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Fully Automatic Compound Cleaving Line (Scribing, Cleaving, Laminating)
Anwendungsbereiche

Fully Automatic Compound Cleaving Line (Scribing, Cleaving, Laminating)

Maschinenmerkmale

1. The brightness of light sources at different positions can be set independently according to product functions, effectively addressing product discrepancies.

2. Main functions: Magazine loading (25 iron rings), compound cleaving & scribing, fully automatic film laminating and fully automatic cleaving.

3. Equipped with industrial vision system for efficient recognition of wafer contours and notches.

4. Supports fully automatic operation for various products including wafers, bars, potassium nitride bars and cells.

5. Compliant with SEMI standards and SECS-GEM communication protocol.

Anwendungsbereiche

Our key equipment models serve multiple chip segments such as optical devices, laser chips and optical communication chips.


LED-Industrie
Technical Data Sheet

Parameter

Value

Substrate Material

GaAs, InP, GaN, SiC, Si and other substrates

Processing Size

4/6/8 inch

Bar Chips

Bar dimension: 4.5mm30mm; Single chip: 0.10mm4.5mm

X-Y Travel Range

160mm*160mm

Positioning Accuracy

Repeat positioning accuracy: ±2μm; Positioning accuracy: ±2μm

Transmission System

Load port, robot, aligner


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+86-400-666-4000
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