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1. Linear laser spot to perform lift‑off processing on workpieces of different sizes;
2. The air‑flotation worktable achieves contact‑free and friction‑free machining to prevent particle generation and ensures the internal cleanliness of the equipment.
3. High‑precision, large‑size dual‑station configuration delivers substantially imporved production efficiency.
4. Adsorption design for the panel carrier: the vacuum‑chuck of the material carrier adopts zoned adsorption with time‑delay control. Suction begins at the central region and proceeds outward in sequence, so that panels covered with flexible‑film can be tightly adsorbed free‑of‑wrinkle with high efficiency.
Laser lift‑off processing for flexible display panels
Machine Model | Laser Lift-off Equipment |
Workpiece Size | 1 -8 inch |
Processing Speed | 180mm/s |
Processing Accuracy | 0.1μm |
Accuracy | 1)Movement Accuracy |
Laser‑Source Specifications | 1)Laser Wavelength: 308nm |
Process Mode | DPSS Laser Lift‑Off |
Process Type | Laser Lift‑Off |
Tact Time | 1 inch: 4.5s |
Equipment Utilization | 0.9 |