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Laser Lift-off Equipment

Laser Lift-off Equipment

Maschinenmerkmale

1. Linear laser spot to perform lift‑off processing on workpieces of different sizes;

2. The air‑flotation worktable achieves contact‑free and friction‑free machining to prevent particle generation and ensures the internal cleanliness of the equipment.

3. High‑precision, large‑size dual‑station configuration delivers substantially imporved production efficiency.

4. Adsorption design for the panel carrier: the vacuum‑chuck of the material carrier adopts zoned adsorption with time‑delay control. Suction begins at the central region and proceeds outward in sequence, so that panels covered with flexible‑film can be tightly adsorbed free‑of‑wrinkle with high efficiency.


Anwendungsbereiche

Laser lift‑off processing for flexible display panels

Technical Data Sheet

Machine   Model

Laser   Lift-off Equipment

Workpiece   Size

1 -8   inch

Processing   Speed

180mm/s

Processing   Accuracy

0.1μm

Accuracy

1)Movement Accuracy
  X -Axis: 0.1μm
  Y -Axis: 0.1μm
  Z -Axis: 1μm
  Theta -Axis: 0.2°
  2)Positioning Accuracy
  X -Axis: ≤±4μm
  Y -Axis: ≤±4μm
  Z -Axis: ≤±5μm
  Theta -Axis: 0.1°

Laser‑Source   Specifications

1)Laser Wavelength: 308nm
  2)Laser Power: ≥600W
  3)Laser Pulse Energy: 1000mJ
  4)Frequency: 600 Hz
  5)Pulse Duration: 24±4ns
  6)Pulse‑to‑Pulse Stability:   ≤1%

Process   Mode

DPSS Laser   Lift‑Off

Process   Type

Laser   Lift‑Off

Tact Time

1 inch:   4.5s
  8 inch: 6s

Equipment   Utilization

0.9


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